| Product P/N |
Total
Thickness (um) |
Type | Carrier | Bonding Strength MPa SUS/SUS | Soft Point (℃） | Color | Adhesive Type | Pre-Lamination | Recommended Bonding Conditions | Feature/Application |
| HT Series | ||||||||||
| HT6501 | 10 | Double-sided | E | >2 | 50-70 | Transparent |
Thermal Setting |
Glue
Line Temperature. 50-70°C Dwell Time: 5-15 Seconds Pressure: 2-4 Bar |
Glue
Line Temperature: min.120°C Dwell Time: 30-120 Seconds Pressure: 2.8-5 Bar |
1.Weak
adhesion at room temperature, good adhesion to metal, glass and PI after
curing
2.Good impact performance and heat/moisture resistance
3.No further post-curing is required after thermal activation during
bonding
|
| HT2013P | 130 | Single-sided | PI/PET | >7 | Amber/Black |
Thermal
Setting
|
2
kg rubber hand roller 5 mm/s, 3 times in each direction |
150℃*10min+180℃*20min | Electrical insulation;Cooling Plate | |
| HT5601 | 10 | Double-sided | none | >3 | 90-120 | Transparent |
Thermal Setting |
Glue
Line Temperature. 35-130°C Dwell Time: 5-30 Seconds Pressure: 3-11 Bar |
Glue
Line Temperature: 170-200°C Dwell Time: 10-30 min Pressure: 3-11 Bar |
1.High
temperature resistance after curing
2.Outstanding resistance against chemicals
3.Good adhesion on metals, glass, ceramic materials, textiles, and polymer
film after curing.
4.Easy handling performance for die cutting
|
| HT5602 | 20 | Double-sided | none | >4 | 90-120 | Transparent |
Thermal Setting |
Glue
Line Temperature. 35-130°C Dwell Time: 5-30 Seconds Pressure: 3-11 Bar |
Glue
Line Temperature: 170-200°C Dwell Time: 10-30 min Pressure: 3-11 Bar |
1.High
temperature resistance after curing
2.Outstanding resistance against chemicals
3.Good adhesion on metals, glass, ceramic materials, textiles, and polymer
film after curing.
4.Easy handling performance for die cutting
|
| HT5610 | 100 | Double-sided | none | ＞20 | 90-120 | Transparent |
Thermal Setting |
Glue
Line Temperature. 50-70°C Dwell Time: 5-15 Seconds Pressure: 2-4 Bar |
Glue
Line Temperature: 180-200°C Dwell Time: 10-30 min Pressure: 2-5 Bar |
1.High
temperature resistance after curing
2.Outstanding resistance against chemicals
3.Good adhesion on metals, glass, ceramic materials, textiles, and polymer
film after curing.
4.Easy handling performance for die cutting
|
| LT Series | ||||||||||
| LT0100B | 100 | Double-sided | none | >5 | 45-60 | Black |
Thermal Setting |
Glue
Line Temperature. 50-60°C Dwell Time: 5-15 Seconds Pressure: 2-4 Bar |
Glue
Line Temperature: min.75°C Dwell Time: 30-120 Seconds Pressure: 2.8-5 Bar |
1.
Extremely strong bonding for leather, PC. metal, etc.
2. Activated at low temperature and pressure
3. Thermal setting type, can't be re-activated
|
| LU Series | ||||||||||
| LU2305 | 50 | Double-sided | none | >10 | / | Transparent |
UV Setting |
2
kg rubber hand roller 5 mm/s, 3 times in each direction |
70mW
365nm LED@60sec 70℃@3hrs |
1.Tackiness
at room temperature for handling
2.UV curing of opaque substrates
3.Can be heat accelerated to reduce curing time
4.Have good strength and reliability on metals, plastics, textiles, and
glass
|
| LU2311L | 110 | Single-sided | PET | >5 | / | Blue |
UV Setting |
2
kg rubber hand roller 5 mm/s, 3 times in each direction |
70mW
365nm LED@60sec 70℃@3hrs |
Electrical insulation |
| TP Series | ||||||||||
| TP3002 | 20 | Double-sided | none | >2 | 90-120 | Transparent |
Thermal Setting |
Glue
Line Temperature. 50-70°C Dwell Time: 5-15 Seconds Pressure: 2-4 Bar |
Glue
Line Temperature: min.140°C Dwell Time: 30-120 Seconds Pressure: 2.8-5 Bar |
1.Weak
adhesion at room temperature, good adhesion to metal, glass and PI after
curing
2.Good impact performance and heat/moisture resistance
3.No further post-curing is required after thermal activation during
bonding
4.Zero emissions, zero VOC
|
| TL Series | ||||||||||
| TL5010 | 100 | Double-sided | none | >2 | 50-80 | Transparent |
Thermal Setting |
Glue
Line Temperature. 25-70°C Dwell Time: 5-15 Seconds Pressure: 1-5 Bar |
Glue
Line Temperature: 70-100°C Dwell Time: 5-60 s Pressure: 1-5 Bar |
1.Tack
at room temperature applicable as a pressure sensitive tape
2.Outstanding resistance against heat and chemicals
3.Good adhesion on SUS, AL, PI, PC, Glass and black coating Glass after
activation.
4.Easy handling performance for die cutting
|
| TL5025B | 250 | Double-sided | none | >2 | 50-80 | Black |
Thermal Setting |
Glue
Line Temperature. 25-70°C Dwell Time: 5-15 Seconds Pressure: 1-5 Bar |
Glue
Line Temperature: 70-100°C Dwell Time: 5-60 s Pressure: 1-5 Bar |
1.Tack
at room temperature applicable as a pressure sensitive tape
2.Outstanding resistance against heat and chemicals
3.Good adhesion on SUS, AL, PI, PC, Glass and black coating Glass after
activation.
4.Easy handling performance for die cutting
|
| EM Series | 50-100 | Double-sided | Cu/none | >7 | 90-120 | Brownish red |
Thermal Setting |
Glue
Line Temperature. 50-70°C Dwell Time: 5-15 Seconds Pressure: 2-4 Bar |
Glue
Line Temperature: 180-200°C Dwell Time: 10-30 min Pressure: 2-5 Bar |
1.High
temperature resistance after curing
2.Outstanding resistance against chemicals
3.Good adhesion on metals, glass, ceramic materials, textiles, and polymer
film after curing.
4.Easy handling performance for die cutting
5.Good conductivity
|
| TM Series | 50-100 | Double-sided | none | >7 | 90-120 | White |
Thermal Setting |
Glue
Line Temperature. 50-70°C Dwell Time: 5-15 Seconds Pressure: 2-4 Bar |
Glue
Line Temperature: 180-200°C Dwell Time: 10-30 min Pressure: 2-5 Bar |
1.High
temperature resistance after curing
2.Outstanding resistance against chemicals
3.Good adhesion on metals, glass, ceramic materials, textiles, and polymer
film after curing.
4.Easy handling performance for die cutting
5.Good thermal conductivity
|
